SURFACE AND INTERFACIAL PROPERTIES OF Fe-C-O-Cr ALLOYS IN CONTACT WITH ALUMINA
Abstract
In this paper, temperature and concentration dependencies of density and surface tension of liquid Fe-C-O-Cr alloys (1.93 - 4.76 wt.% Cr) were investigated in high-temperature resistance observation furnace by a sessile drop method during heating from liquidus temperature to 1600 °C. The interfacial characteristics (interfacial tension, wetting angle, work of adhesion and spreading coefficient) of liquid alloy/alumina system were also determined depending on temperature. The effect of temperature and chromium content on surface and interfacial properties was of proven in case of all examined alloys. On the ground that the content of surface-active elements such as oxygen (up to 195 ppm) and sulfur (up to 545 ppm) was higher, the influence of activities of both mentioned elements on surface tension of alloy samples was assessed. Particular attention was paid to the dependence of the surface tension temperature coefficient on oxygen and sulfur activity.
References
N. Sobczak, M. Singh, R. Asthana, Curr. Opin. Solid St. M., 9 (4–5) (2005) 241–253.
K. Morohoshi, M. Uchikoshi, M. Isshiki, H. Fukuyama, ISIJ Int., 53 (8) (2013) 1315–1319.
M. J. McNallan, T. Debroy, Metall. Mater. Trans. B, 22 (4) (1991) 557–560.
S. Ozawa, K. Morohoshi, T. Hibiya, ISIJ Int., 54 (9) (2014) 2097–2103.
F. Xiao, L. Liu, R. Yang, H. Zhao, L. Fang, Ch. Zhang, T. Nonferr. Metal. Soc., 18 (5) (2008) 1184-1188.
J. Campbell, Complete Casting Handbook: Metal Casting Processes, Metallurgy, Techniques and Design 2nd Edition, Butterworth-Heinemann, Oxford, 2015, p. 21.
E. E. Tret´yakova, E. A. Klimenkov, B. A. Baum, G.V. Tyagunov, Steel USSR, 15 (8) (1985) 391–392.
Z. Li, M. Zeze, K. Mukai, Mater. Trans., 44 (10) (2003) 2108–2113.
K. Mukai, Z. Li, M. Zeze, Mater. Trans., 43 (7) (2002) 1724–1731.
T. Yoshikawa, K. Yamamoto, T. Tanaka, K. Morita, J. High Temp. Soc., 32 (5) (2006) 289–294.
X. Zhang, H. Matsuura, F. Tsukihashi, Z. Yuan. Mater. Trans. 53 (5) 2012 926-931.
J. Lee, W. Shimoda, T. Toshihiro, Mater. Trans., 45 (9) (2004) 2864–2870.
J. Li, Z. Yuan, Z. Qiao, J. Fan, Y. Xu, J. Ke. J. Colloid Interf. Sci., 297 (1) 2006 261-265.
Z. Li, K. Mukai, M. Zeze, K. C. Mills, J. Mater. Sci., 40 (9–10) (2005) 2191–2195.
K. C. Mills, B. J. Keene, R. F. Brooks, A. Shirali, Philos. T. Roy. Soc. A, 356 (1739) (1998) 911–925.
T. Matsumoto, T. Misono, H. Fujii, K. Nogi, J. Mater. Sci., 40 (9-10) (2005) 2197–2200.
R. F. Brooks, P. N. Quested, J. Mater. Sci., 40 (9-10) (2005) 2233–2238.
T. Dubberstein, H. Heller, Steel Res. Int., 84 (9) (2013) 845–851.
T. Dubberstein, H. Heller, J. Klostermann, R. Schwarze, J. Brillo, J. Mater. Sci., 50 (22) (2015) 7227–7237.
Z. Yuan, J. Li, Y. Pan, J. Fan, J. Ke. Process Met., 77 (7) 2006 495-499.
Z. Yuan, K. Mukai, W.L. Huang. Langmuir., 18 (6) 2002 2054-2062.
O.I. del Río, A.W. Neumann. J. Colloid Interf. Sci., 196 (2) 1997 136-147.
P.H. Saksono, D. Perić. Comput. Mech., 38 (3) 2006 265-281.
W.H. Kruskal, W.A. Wallis. J. Am. Stat. Assoc., 48 1952 907-911.
K. Nogi, K. Ogino, Can. Metall. Quart., 22 (1) (1983) 19-28.
S. K. Rhee, J. A. Ceram. Soc., 55 (3) (1972) 157-159.
S. Ross, P. Becher, J. Colloid Interf. Sci., 149 (2) (1992) 575–579.
Y. Ahn, J. Seo, O. Park. J. Cryst. Growth, 326 2011 45 – 49.
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