Development of heat-resistant Pb-free joint by TLPS process of Ag and Sn-Bi-Ag alloy powders

  • Ikuo Ohnuma Department of Materials Science, Graduate School of Engineering, Tohoku University, Japan

Abstract


TLPS (Transient Liquid Phase Sintering) process is a candidate method of heat-resistant bonding, which makes use of the reaction between low-melting temperature powder of Sn-Bi base alloys and reactive powder of Ag. During heat treatment above the melting temperature of a Sn-Bi base alloy, the molten Sn-Bi reacts rapidly with solid Ag particles, which results in the formation of heat-resistant intermetallic compound (IMC). In this study, the TLPS properties between Sn-17Bi-1Ag (at.%) powder with its liquidus temperature of 200°C and pure Ag powder were investigated. During differential scanning calorimetry (DSC) measurement, an exothermic reaction and an endothermic reaction occurred, which correspond to the formation of the e-Ag3Sn IMC phase and the melting of the Sn-17Bi-1Ag alloy, respectively. After the overall measurement, the obtained reactant consists of the Ag3Sn-IMC and Bi-rich phases, both of which start melting above 250°C, with a small amount of the residual Sn-Bi eutectic phase. These results suggest that the TLPS process can be applied for Pb-free heat-resistant bonding.

Key words: Transient Liquid Phase Sintering (TLPS), CALPHAD, High-tepmerature Pb-free solder

Published
2014/02/10
How to Cite
Ohnuma, I. (2014). Development of heat-resistant Pb-free joint by TLPS process of Ag and Sn-Bi-Ag alloy powders. Journal of Mining and Metallurgy, Section B: Metallurgy, 48(3), 413. Retrieved from https://aseestant.ceon.rs/index.php/jmm/article/view/2957
Issue
Vol. 48 No. 3 (2012)
Section
Original Scientific Paper

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