Thermodynamic properties of the liquid Ag-Bi-Cu-Sn Lead-Free Solder Alloys
Abstract
AbstractThe electromotive force measurement method was employed to determine the thermodynamic properties of liquid Ag-Bi-Cu-Sn alloys using solid electrolyte galvanic cells as shown below:Kanthal+Re, Ag-Bi-Cu-Sn, SnO2 | Yttria Stabilized Zirconia | air, Pt, Experiments were made within temperature interval: 950 – 1300 K along four composition paths of constant ratios: XAg : XBi : XCu = 1, XAg : (XBi + XCu ) = 3:2 for XBi = XCu , XBi : (XAg + XCu) = 3:2 for XAg = XCu and XCu : (XAg + XBi) = 3:2 for XAg = XBi and tin concentration changing from 0.1 to 0.9 mole fractions, every 0.1. Almost all the results were approximated by straight line equations: EMF vs T, and tin activities were then calculated in arbitrary tem-perature; measurement results were presented by graphs. Unusual activity plot for XBi : (XAg + XCu) = 3:2 composition path was most probably caused by miscibility gap detected earlier in Bi-Cu-Sn ternary liquid alloys.
Authors retain copyright of the published papers and grant to the publisher the non-exclusive right to publish the article, to be cited as its original publisher in case of reuse, and to distribute it in all forms and media.
The Author(s) warrant that their manuscript is their original work that has not been published before; that it is not under consideration for publication elsewhere; and that its publication has been approved by all co-authors, if any, as well as tacitly or explicitly by the responsible authorities at the institution where the work was carried out. The Author(s) affirm that the article contains no unfounded or unlawful statements and does not violate the rights of others. The author(s) also affirm that they hold no conflict of interest that may affect the integrity of the Manuscript and the validity of the findings presented in it. The Corresponding author, as the signing author, warrants that he/she has full power to make this grant on behalf of the Author(s). Any software contained in the Supplemental Materials is free from viruses, contaminants or worms.The published articles will be distributed under the Creative Commons Attribution ShareAlike 4.0 International license (CC BY-SA).
Authors are permitted to deposit publisher's version (PDF) of their work in an institutional repository, subject-based repository, author's personal website (including social networking sites, such as ResearchGate, Academia.edu, etc.), and/or departmental website at any time after publication.
Upon receiving the proofs, the Author(s) agree to promptly check the proofs carefully, correct any typographical errors, and authorize the publication of the corrected proofs.
The Corresponding author agrees to inform his/her co-authors, of any of the above terms.