Interfacial reactions between solid Ni and liquid Sn–Zn alloys

  • Vanya Desimirova Gandova University of Food Technologies, Inorganic and Physical Chemistry Department, 4000 Plovdiv, Bulgaria

Abstract


The limitation of the harmful lead-containing solders used in the electronics and other induistries apply change lead with another metals. Interfasial reactions between Sn-Zn alloys and Ni substrate after annealin at 400 0C and 450 0C were studied. Three intermetallic compounds Ni3Sn4, T1, gamma-Ni5Zn21 and liquid Sn were observed in the Ni/Sn-Zn diffusion couples. Scanning electron microscope was used for investigation samples. The microhardness measurement of the intermetallic layers was apply.
Published
2015/12/18
How to Cite
Gandova, V. D. (2015). Interfacial reactions between solid Ni and liquid Sn–Zn alloys. Journal of Mining and Metallurgy, Section B: Metallurgy, 51(2), 179-184. Retrieved from https://aseestant.ceon.rs/index.php/jmm/article/view/7053
Issue
Vol. 51 No. 2 (2015)
Section
Original Scientific Paper

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