Comparison of the corrosion behavior and surface morphology of NiTi alloy and stainless steels in sodium chloride solution
Abstract
The corrosion behavior of NiTi alloy and stainless steels (AISI 316L and X2CrNiMoN22-5-3) in 0.9% sodium chloride (0.154 moll-1) solution was investigated using open circuit potential measurements, potentiodynamic polarization and electrochemical impedance spectroscopy measurements. Microstructural analyses before and after electrochemical tests were performed with the scanning electron microscopy (SEM) equipped with energy dispersive spectrometry (EDS). The lowest corrosion current density has NiTi alloy and the extent of the passive range increased in the order AISI 316L stainless steel < NiTi alloy < X2CrNiMoN22-5-3 duplex stainless steel. The oxide film formed on all samples has a double-layer structure consisting of a barrier-type inner layer and a porous outer layer. Oxide films formed on the surface of steels mainly contains iron oxides and chromium oxide, while the surface film of the NiTi alloy mainly contains TiO2 oxide.
References
R. Lahoz, J.A. Puértolas, J. Alloy. Compd., 381 (2004) 130-136.
M. Gojić, L. Vrsalović, S. Kožuh, A.C. Kneissl, I. Anžel, S. Gudić, B. Kosec, M. Kliškić, J. Alloy. Compd., 509 (2011), 9782-9790.
A. Creuziger, W.C. Crone, Acta Mater., 56 (2008) 518-526.
G. Manivasagam, D. Dhinasekaran, A. Rajamanickam, Recent Patents on Corrosion Science, 2 (2010) 40-54.
M. Conradi, P.M. Schon, A. Kocijan, M. Jenko, G.J. Vancso, Mater. Chem. Phys., 130 (2011) 708-713.
I. Gurappa, Mater. Charact., 49 (2002) 73-79.
L. Tan, R.A. Dodd, W.C. Crone, Biomaterials, 24 (2003) 3931-3939.
S.A. Shabalovskaya, G.C. Rondelli, A.L. Undisz, J.W. Anderegg, T.D. Burleigh, M.E. Rettenmayr, Biomaterials, 30 (2009) 3662-3671.
S.A. Shabalovskaya, H. Tian, J.W. Anderegg, D.U. Schryvers, W.U. Carroll, J.V. Humbeeck, Biomaterials, 30 (2009) 468-477.
A. Shahryari, S. Omanović, J.A. Szpunar, Mat. Sci. Eng. C., 28 C (2008) 94-106.
I. Juraga, V. Šimunović, Đ. Španiček, METABK, 46 (2007) 185-189.
H. Kerosuo, G. Moe, E. Kleven, Angle Orthod., 2 (1995) 111-116.
B. Guyuron, C. Lasa, Plast. Reconstr. Surg., 89 (1992) 540-542.
J. Ryhanen, E. Niemi, W. Serlo, E. Niemela, P. Sandvik, H. Pernu, T. Salo, J. Biomed. Mat. Res., 35 (1997) 451-457.
H. Kim, J.W. Johnson, Angle Orthod., 69 (1999) 39-44.
R. Koster, D. Vieluf, M. Kiehn, M. Sommerauer, J. Kahler, S. Baldus, T. Meinertz, C.W. Hamm, Lancet, 356 (2000) 1895-1897.
M. Geetha, A.K. Singh, R. Asokamani, A.K. Gogia, Prog. Mater. Sci., 54 (2009) 397-425.
M.L. Pereira, A. Silva, R. Tracana, G.S. Carvalho, Cytobios, 77 (1994) 73-80.
N.K. Veien, E. Bochhorst, T. Hattel, G. Laurberg, Contact Dermatitis, 30 (1994) 210-213.
T.P. Chaturvedi, http://orthocj.com/journal/uploads/2008/01/0054_en.pdf.
ASTM Standard F746-87. Standard test method for pitting and crevice corrosion of metallic surgical implant materials, West Conshohocken, PA: ASTM International; 1987 (Reproved 1999).
T. Hu, C.L. Chu, Y.C. Xin, S.L. Wu, K.W.K. Yeung, P.K. Chu, J. Mater. Res., 25 (2) (2010) 350-358.
K.Y. Chiu, F.T. Cheng, H.C. Man, Surf. Coat. Tech., 200 (2006) 6054-6061.
K. Endo, M. Suzuki, H. Ohno, Dent. Mater. J., 19 (2000) 34-49.
G. Rondelli, B. Vicentini, Biomaterials, 23 (2002) 639-644.
J. Pan, D. Thierry, C. Leygraf, Electrochim. Acta, 41 (1996) 1143-1153.
N. Figueira, T.M. Silva, M.J. Carmezim, J.C.S. Fernandes, Electrochim. Acta, 54 (2009) 921-926.
R. Venugopalan, J.J. Weimer, M.A. George, L.C. Lucas, Biomaterials, 21 (2000) 1669-1677.
I.C. Lavos-Valereto, S. Wolynec, I. Ramires, A.C. Guastaldi, I. Costa, J. Mater. Sci.-Mater. Med, 15 (2004) 55-59.
C.R. Clayton, I. Olefjord, Passivity of austenitic stainless steels, in: P. Marcus, J. Oudar, (Eds.), Corrosion Mechanism Theory and Practice, Marcel Dekker, New York, 1995, p. 175-199.
C.A. Della Rovere, J.H. Alano, R. Silva, P.A.P. Nascente, J. Otubo, S.E. Kuri, Corr. Sci., 57 (2012) 154-161.
I.D. Raistrick, D.R. Franceschetti, J.R. Macdonald, Theory, in: E. Barsoukov, J.R. Macdonald (Eds.), Impedance Spectroscopy, second ed., J. Wiley & Sons, Inc., New Yersey, 2005.
D. Wallinder, J. Pan, C. Leygraf, A. Delblanc-Bauer, Corr. Sci., 41 (1999) 275-289.
V. L'Hostis, C. Dagbert, D. Feron, Electrochim. Acta, 48 (2003) 1451-1458.
A. Kocijan, D. Kek Merl, M. Jenko, Corr. Sci., 53 (2011) 776-783.
Authors retain copyright of the published papers and grant to the publisher the non-exclusive right to publish the article, to be cited as its original publisher in case of reuse, and to distribute it in all forms and media.
The Author(s) warrant that their manuscript is their original work that has not been published before; that it is not under consideration for publication elsewhere; and that its publication has been approved by all co-authors, if any, as well as tacitly or explicitly by the responsible authorities at the institution where the work was carried out. The Author(s) affirm that the article contains no unfounded or unlawful statements and does not violate the rights of others. The author(s) also affirm that they hold no conflict of interest that may affect the integrity of the Manuscript and the validity of the findings presented in it. The Corresponding author, as the signing author, warrants that he/she has full power to make this grant on behalf of the Author(s). Any software contained in the Supplemental Materials is free from viruses, contaminants or worms.The published articles will be distributed under the Creative Commons Attribution ShareAlike 4.0 International license (CC BY-SA).
Authors are permitted to deposit publisher's version (PDF) of their work in an institutional repository, subject-based repository, author's personal website (including social networking sites, such as ResearchGate, Academia.edu, etc.), and/or departmental website at any time after publication.
Upon receiving the proofs, the Author(s) agree to promptly check the proofs carefully, correct any typographical errors, and authorize the publication of the corrected proofs.
The Corresponding author agrees to inform his/her co-authors, of any of the above terms.