Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation

  • Jelena S Lamovec Institute for Chemistry, Technology and Metallurgy - The Microelectronic Technologies Department,University of Belgrade
  • Vesna Jovic Institute for Chemistry, Technology and Metallurgy - The Microelectronic Technologies Department,University of Belgrade
  • Stevo Jacimovski The Academy of Criminalistic and Police Studies, Cara Dusana Street 196, 11080 Zemun, Belgrade, Serbia
  • Goran Jovanov The Academy of Criminalistic and Police Studies, Cara Dusana Street 196, 11080 Zemun, Belgrade, Serbia
  • Vesna Radojevic Faculty of Technology and Metallurgy,University of Belgrade, 11000 Belgrade, Serbia
  • Jovan Setrajcic University "Union - Nikola Tesla", Faculty of Sport, Narodnih heroja 30/I, 11070 Belgrade, Serbia

Abstract


Composite systems of monolayer and multilayer nickel films electrochemically deposited on single crystal (100)-oriented silicon wafers were fabricated with and without the ultrasonic agitation. The hardness and adhesion behaviour of these composite structures were characterized by Vickers microindentation test. The dependence of composite microhardness and film adhesion on the structure of the film and mixing conditions of  electrolyte was analysed. Mathematical models of Chicot-Lesage and Chen-Gao were applied to experimental data in order to obtain the film hardness and adhesion parameter, respectively. It is confirmed that the mechanical properties of nickel films on silicon substrate composite systems can be enhanced by introduction of ultrasound-assisted electrodeposition and by reducing the layer thickness in the film.

Keywords: composite hardness, film adhesion, ultrasound-assisted electrodeposition, multilayer nickel films

Author Biography

Jelena S Lamovec, Institute for Chemistry, Technology and Metallurgy - The Microelectronic Technologies Department,University of Belgrade
Viši naučni saradnik, Inženjerstvo materijala, Mikroelektronske tehnologije
Published
2019/03/05
Section
Original Scientific Papers