Experimental study of the Cu-Al-Sn phase equilibria, close to the copper zone
Abstract
The ternary Cu-Al-Sn phase diagram is the base for several important types of alloys, with relevant industrial interest and applications. The knowledge of the melting/solidification alloys characteristics are determinant for their preparation and properties control. However, there is a lack of experimental information on the ternary phase diagram, at high temperature. In this work, several alloys, with high copper content and additions of Al, up to 10%, and Sn, up to 14% (in wt%), were studied by thermal analysis and by isothermal phase equilibria determination. The alloys liquidus and solidus lines and the binary α + β phase field, at 800 °C, are presented for the studied range of compositions.
References
P. Norbert, L. L. Christian e W. R. Klaus, “Re-investigation of phase equilibria in the system Al-Cu and structural analysis of the hight-temperature phase Al-Cu,” Intermetallics, vol. 19, (2011), p. 1740.
A. K. Chakrabarty and K.T. Jacob, “Experimental Study of Phase Equilibria in the System Cu-Al-Sn,” Journal of Phase equilibria and Diffusion , vol. 34, (2013), pp. 267-275.
H. Watanabe, N. Konom, T. Sengoku, M. Ishizaka, Shindo Gijutsu Kenkyukai-Shi 14 (1) (1975) 170–183
J.S.L. Leach, G.V. Raynor, Proc. Roy. Soc. A 224 (1954) 251–259.
D. Mirkovic, J. Gröbner, R. Schmid-Fetzer, Materials Science and Engineering A 487 (2008) 456–467.
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